ICPT 2024 - International Conference on Planarization/ CMP Technology
The 19th International Conference on Planarization/CMP Technology 2024 - ICPT2024 - was held in Wiesbaden, Germany. The European CMP User Groups invited you to this amazing health resort city – one of Germany’s hidden champions. Following European venues such as Dresden, Grenoble and Leuven, we were proud to have again chosen Europe as venue for the ICPT Conference 2024 and hope you agree that this was a wonderful event.
Chemical Mechanical Planarization/Polishing (CMP), one of the most important processes in the manufacturing of semiconductor devices, has been developed and improved continuously year after year, it has maintained its position in related industries, and has increased its application areas. From the user’s point of view, technical demand is growing more and more, and fields of application beyond the semiconductor sector are increasing equally.
ICPT as an international symposium for Planarization/CMP offered magnificent opportunities for discussions on technologies including FEOL and BEOL CMP, 3D/TSV, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, Green Devices, New Applications, Metrology, Cleaning, Defect Control, Process Control, CMP Alternatives, SiC, GaN, Sapphire and Diamond. The conference provided a place where researchers and engineers alike met, discussed and shared experiences in their field of knowledge. Enthusiastic presentations and discussions were on an equal footing, flat like the surface of wafer, no matter from which country or organization presenters came, which position they held or in which technology area they had gained experience or were experts.
The organizing committee aimed at offering good opportunities for every attendee to learn something new or expand their networks through discussions or information exchange in the field of CMP.
Knut Gottfried, Viorel Balan,
Patrick Ong, Catharina Rudolph,
Eric Jacquinot, Cedric Perrot, Cathérine Euvrard
